The ion gun is differentially pumped with a t urbomolecular pump to minimize sample contamination due to ion pump regurgitation of active gases caused by hard to pump argon gas. Rastered argon ion etching gun to maximize etching uniformity.The introduction chamber is also brought to atmospheric pressure using nitrogen gas to minimize water absorption on the introduction chamber walls and subsequently minimizing it upon sample insertion. Samples pumped in the sample introduction chamber pass through the sample preparation chamber to the analysis chamber, so the analysis chamber is exposed to very little gas load, which is primarily water vapor, when new samples are introduced.
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The sample preparation chamber between the introduction chamber and the XPS analysis chamber has a large ion pump, as does the XPS analysis chamber.
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The introduction chamber is pumped with a turbomolecular pump.
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Surface analysis of inorganic compounds, ceramics, glasses, polymers, semiconductors, metals, composite materials, and strongly adsorbed liquids or gases on surfaces (such liquid or gas layers are not usually visible).Samples and Materials Suited to XPS Surface Analysis Elemental composition as a function of depth from 2 μm to 2 mm using a radial sectioner coupled with ion beam etching to clean the final surface of smeared softer materials and the effects of post-abrasion air exposure, allowing this surface analysis technique to perform deep sub-surface analysis.Depth profiles using ion beam etching for elemental compositions as a function of depth in metals and inorganic materials to depths as great as 3 μm, allowing this surface analysis technique to perform sub-surface analysis.Anderson in the early 1990s these complex chemical phases are common on surfaces or interfaces, as they are in minerals Identification and separation of complex chemical phases by differences in surface potentials using a technique developed by Dr.Extensive chemical phase identification based on binding energy shifts characteristic of different bonding configurations and quantitative component analysis.Similarly, the weight ppm is also lower than the atomic ppm for these elements in most glasses and ceramics or even most metal alloys. In weight percent, the detection limit for lead and mercury in most polymers is less than 2 ppm, while that for cadmium is about 3 ppm.Detection limits of 0.001 to 0.005 atomic percent (or 10 – 50 ppm) for heavy metals, 0.03 at.% for lighter transition metals, 0.2-0.4 at.% for O, N, and C, and about 0.4-1.0 at.% for Li, Be, and B.
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Quantitative elemental analysis of all elements, except hydrogen and helium, which is generally free of matrix effects which degrade quantitative accuracy, unlike Auger Electron Spectroscopy, EDS, XRF, and FTIR.
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